Bring the best quality and services

Follow us


Soldering Electronic & Flux

Soldux solder paste
Solder paste
Solder Nippon Filler Metals
500g/bottle

Lead-free solder paste of our newly developed, printability, adhesion, storage stability, as well as flux residue of corrosion resistance and insulation resistance after reflow, also, in the water wash type has excellent washability

PBF NO.
Alloy composition
Powder particle size 
(μm)
Melting temperature 
(℃)
Features - intended use
Sn
Ag
Cu
PBF 10
96.5
3.5
-
25-45 
20-30 
10-25
221
Binary system eutectic composition
PBF 11
96.0
3.5
0.5
217
Ternary eutectic composition
PBF 111
96.5
3.0
0.5
217-219
JEITA recommended composition, general-purpose products

Preliminary heating : 170-190 oC (60-120s)

Heating : 235-245 oC (more than 30s)

Atmosphere : Air or nitrogen 

 

Same products


Home                   Corporation Profile           Our services             Main Products             Catalogue             Contact

Copyright © Qualiserv VietNam. All rights reserved.

Design by The START