One component (thermal curing) epoxy adhesive
Single component, No mixing- Increased throughput
Superior strength
Excellent performance on variety of substrates
Highly reliable
Excellent thermal, moisture, environmental, and chemical resistance
For electronic component re-enforcement, under fill
Other
Low Chlorine (Cl), Bromine (Br) / EU RoHS compliant
Features | Suitable Products |
For general purpose with various viscosities | AY-5302、AY-5231、AY-5274 |
Uniquely formulated for various purposes | AY-5158、AY-5218C、AY-5218D |